| 摘要 |
PURPOSE: To bond a pellet well by enhancing the wettability and spreading of adhesive when a pellet is bonded using an adhesive, e.g. a conductive paste. CONSTITUTION: The method for bonding a semiconductor pellet to the island part 1a of a lead frame comprises a step for coating the island part 1a with a conductive paste 3, a step for imparting a vibration to the island part 1a, and a step for bonding the semiconductor pellet, being sucked by a collet, the island part 1a after the vibration step.
|
