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发明名称
HEAT SINK AND MOUNTING STRUCTURE OF ELECTRONIC COMPONENT WHICH USES THE HEAT SINK
摘要
申请公布号
JPH08306834(A)
申请公布日期
1996.11.22
申请号
JP19950104101
申请日期
1995.04.27
申请人
MITA IND CO LTD
发明人
IRITANI KAZUNOBU
分类号
H01L23/40;(IPC1-7):H01L23/40
主分类号
H01L23/40
代理机构
代理人
主权项
地址
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