| 发明名称 |
METHOD AND APPARATUS FOR COATING SEMICONDUCTOR CHIP WITH CONDUCTIVE PASTE FOR DIE BONDING |
| 摘要 |
PURPOSE: To suppress defective die bonding when the semiconductor mounting part of a lead frame or the like is coated with a conductive pate for die bonding. CONSTITUTION: A rectangular semiconductor chip is coated with a conductive paste 1 in rectangular shape having outer dimensions smaller than those of the rectangular semiconductor chip with each side 21a being recessed inward.
|
| 申请公布号 |
JPH08306715(A) |
申请公布日期 |
1996.11.22 |
| 申请号 |
JP19950108393 |
申请日期 |
1995.05.02 |
| 申请人 |
ROHM CO LTD |
发明人 |
YAMADA KAZUNORI |
| 分类号 |
C09J163/00;H01L21/52;(IPC1-7):H01L21/52 |
主分类号 |
C09J163/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
