PRODUCTION OF PROBE CARD

摘要

PURPOSE: To break oxide deposited on the surface of inspection electrode of a semiconductor chip surely by forming irregularities uniformly on the top surface of a bump. CONSTITUTION: Bumps to be connected with the inspection electrodes of a semiconductor chip are formed on the surface of a flexible board. A plating layer 21 of harder material than the bump 14 on the flexible board 12 provided with protrusions or recesses having diameter equal to or less than one half of the bump 14 is then formed a flat metal plate 20. The plating layer 21 of the flat metal plate 20 is pressed against the top surface of bumps 14 thus forming irregularities on the top surface of bumps 14.