| 摘要 |
PURPOSE: To provide die for resin sealing a semiconductor device and a production method in which the resin can be left surely at upper and lower resin sumps while eliminating the gate break step. CONSTITUTION: Upper and lower dies comprises a cavity 17, an air vent 18, gate drawing parts 15, 16a having a drawing angle for molding a resin sump, a runner part 11, and a transfer pot 8. The lower die 2a is provided with a shutter 22a for removing the resin in the runner by moving up and down. The shutter 22a is disposed within a range covering the end part of a lead frame 7a and the starting point of gate drawing angle. More specifically, the shutter 22a is disposed such that the resin sump 12 of lower die 2a is left surely. Since the lead frame mounting a semiconductor chip is held between the dies and clamped, a semiconductor package can be molded without requiring any gate break. |
