| 摘要 |
PROBLEM TO BE SOLVED: To reduce the thickness of a bonding part position and the size of a package, and improve electrical characteristics by performing bumper bonding instead of a wire bonding. SOLUTION: On a bonding pad 20 of a solid-state image sensing device 11, bonding bumpers 12 made of metals are formed, and thereon inner leads 15 are positioned, which are connected with the bonding bumpers 12 by thermo- compression bonding. Hence an electrical connection is obtained. An insulator wall 13 which covers the connection parts of the bonding bumpers 12 and the inner leads 15 having a specified area and height is formed on the upper surface of the device 11, except a light receiving region 19. Thereby the thickness of the bonding part position and the size of a package can be reduced. In molding, compound can be prevented form flowing into the light receiving region.
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