| 摘要 |
<p>PROBLEM TO BE SOLVED: To manufacture a high reliable multiple chip module by using the minimum number of manufacturing stages by providing an outside insulating layer on the first face of a base insulating layer having patterned metallization layers on the both faces, and attaching a circuit chip to the second face. SOLUTION: A device is provided with a base insulating layer 10 having first and second patterned metallization layers 12 on first and second faces, and an outside insulating layer 14 faced to the first face and the first metallization layer 12. Moreover, at least one circuit chip 16 having a chip pad 18 is attached to the second face so that the chip pad 18 of the circuit chip 16 can be insulated from the second metallization layer 12. Also, each path 24 is formed to each part of the first and the second metallization layers 12 and the chip pad 18 through the base layer 10 and the outside insulating layer 14. Then, a patterned outside metallization layer 26 extended through the selected path 24 is provided on the outside insulating layer 14, and the selected chip pad 18 is interconnected with the selected first and second metallization layers 12.</p> |
