| 摘要 |
<p>PURPOSE: To prevent characteristics deterioration of lead terminals and corrosion of solder for a long term, by coating at least the lead terminals and their junction parts out of the lower surface of a substratum, with a ceramic film excellent in oxidation resistance. CONSTITUTION: A ring-shaped sealing member 8 is bonded to the lower surface of a substratum so as to enclose lead terminals 5. Between the sealing member 8 and the process chamber of a film forming equipment, an O ring or the like is interposed for sealing. The whole part of the lower surface of the substratum containing the lead terminals 5 and the sealing member 8 is coated with a ceramic film 6 composed of one out of silicon carbide, silicon nitride, sialon and aluminum nitride. Lead wires 7 are connected with the tip parts of the lead terminals 5, to which currents are applied.</p> |
