| 摘要 |
PURPOSE: To allow a perforation process with good productivity and at a low cost even in the case of a complex shape by forming an insulation base material of photosensitive resin and performing exposure and developing of the photosensitive resin so as to form holes for connection. CONSTITUTION: In conjunction with forming an insulation base material in a circuit board K of photosensitive resin, holes 7 for connection to be used at the time of connection an IC chip module 1 to a mother board and the IC chip to respective circuit patterns are formed by using an ordinary photolithographic technique performing exposure and developing to a photosensitive insulation base material. Thereby, a unlike usual IC chip module and without using a drill process, a punching process, an etching process and a laser process in spite of a complex shape of the hole 7 for connection, a perforation process can be performed with good productivity and at a low cost. |
