| 摘要 |
PURPOSE: To provide a metallic board base material which has on its one face, a resin insulating layer and a conductive metal foil formed in order and is to be used for a printed wiring board and which has on its other face, a resin layer that has an antiblocking property, a resistance to etchant, and a solvent washability. CONSTITUTION: In order to prepare a polyester resin layer, 50-150 pts.wt. of a mixture of butylated melamine resin and methylated melamine resin is added to 100 pts.wt. of polyester resin of a number average molecular weight 6000 or smaller. In the mixture of butylated melamine resin and methylated melamine resin, the ratio of butylated melamine resin to methylated melamine resin is 95/5-70/30. The prepared polyester resin layer has a test wherein a cylinder of 0.5mm in diameter is placed and a load of 25kg/cm<2> is applied from on the cylinder and the temperature is increased at the rate of 5K/min. from 20 deg.C in the air. Those of the layers that have a rate of change in film thickness of 15% or less at the temperature of 200 deg.C in the test are used for a printed wiring board. Such a layer is burned and hardened to be formed on the printed wiring board in the thickness of 5-30μm.
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