| 摘要 |
PURPOSE: To connect a semiconductor chip with an auxiliary wiring board piece at high conduction success rate by connecting the semiconductor chip through a metal bump with the auxiliary wiring board piece while sucking the auxiliary wiring board piece to a smooth base. CONSTITUTION: The semiconductor device comprises an inner electrode 21 to be connected with the electrode 11 of a semiconductor chip 1, an outer electrode 22 to be connected with the end of conductor of a circuit board piece to be mounted, and an interconnection conductor 23 stretching between the electrodes 21, 22. An auxiliary wiring board piece 2 provided with such wiring pattern on plastic films 24, 25 is connected, on the inner electrode 21 side, with the electrode 11 of semiconductor chip 1 through a metal bump 211. Furthermore, the gap between the auxiliary wiring board piece 2 and the semiconductor chip 1 is filled with a sealing resin 3 thus producing a semiconductor device. In this regard, the auxiliary wiring board piece 2 is connected with the semiconductor chip 1 through a metal bump 231 while sucking the auxiliary wiring board piece 2 to a smooth base 4. For example, the auxiliary wiring board piece 2 is secured to a low pressure suction smooth base 4 and the semiconductor chip 1 is thermocompresed before being resin sealed. |
