| 摘要 |
PURPOSE: To rewrite temperature compensation data without a defect such as complicated manufacture process or malfunction due to mis-connection of terminals by providing a recessed part to a proper position in the middle of a lower side of a package and fixing a continuity terminal for internal memory rewrite to the inner bottom of the recessed part. CONSTITUTION: Conductor patterns arranged between each of ceramics layers 2 forming a package 1 are electrically connected by via-holes as required. Then inter-layer conductive patterns connected respectively electrically to an input output conductor terminal 16a arranged to an end ridge of the package 1 or an internal memory rewrite conducting terminal 16b arranged to an inner bottom side of a recessed part 15 provided in the middle of a lower side of the package 1 by via-holes. In the adjustment after the assembling, a jig is used to connect a jumper pin to the input output terminal 16a and the adjustment terminal 16b to secure electric connection and data are rewritten to a memory in an IC chip 6. |
