发明名称 NONDIRECTIVE HIGH FREQUENCY ULTRASONIC WIRE BONDER
摘要 PURPOSE: To provide a nondirective ultrasonic wire bonder in which alignment is not required between the longitudinal direction of wire and the direction of an ultrasonic phone. CONSTITUTION: An ultrasonic oscillator for wire bonder has bolting Langevin structure for clamping an electrostrictive element 1 by means of the uniaxial structure of an ultrasonic phone 3 and a back face body 2 wherein the oscillator has resonance frequency of 330kHz or above and a length equal to or longer than one wavelength of longitudinal oscillation.
申请公布号 JPH08306746(A) 申请公布日期 1996.11.22
申请号 JP19950125663 申请日期 1995.04.27
申请人 TSUJINO JIROMARU 发明人 TSUJINO JIROMARU
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
代理机构 代理人
主权项
地址