发明名称 |
Chip card contg. chip module embedded in card having at least two metallisation areas |
摘要 |
Card for use as telephone card, bank card etc. mounts a chip module (2) with a structured metallisation forming contact area in /- 2 areas (20*. 20**), such that the outer, visible layer is of different metals and/or metal alloys with different light reflection and absorption characteristics. Also claimed is a method of mfg. a chip card from a plastic substrate on which a basis metallisation, pref. of laminated Cu, is applied by electrodeposition, the different areas being formed with the aid of selective blanking off.
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申请公布号 |
DE19532223(C1) |
申请公布日期 |
1996.11.21 |
申请号 |
DE19951032223 |
申请日期 |
1995.09.01 |
申请人 |
ORGA KARTENSYSTEME GMBH, 33104 PADERBORN, DE |
发明人 |
TRUEGGELMANN, UWE, 33098 PADERBORN, DE;WENDISCH, KARL-HEINZ, 33154 SALZKOTTEN, DE |
分类号 |
B44F1/12;C25D5/02;C25D7/00;G06K19/077;G06K19/08;(IPC1-7):B44F1/12;C25D7/12 |
主分类号 |
B44F1/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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