| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A card comprising a capacitor (114), a coil (115), and a thin integrated circuit (312) which are sandwiched between an upper cover sheet (117) and a cover sheet (118). The gaps among them are filled with an adhesive (119). Since the capacitor (114), coil (115), and integrated circuit (312) are extremely thin, a highly reliable inexpensive semiconductor device which is hardly broken by bending is provided. |
| 申请公布号 |
WO9636496(A1) |
申请公布日期 |
1996.11.21 |
| 申请号 |
WO1996JP01264 |
申请日期 |
1996.05.14 |
| 申请人 |
HITACHI, LTD.;USAMI, MITSUO;TSUBOSAKI, KUNIHIRO;MIYAZAKI, MASARU |
发明人 |
USAMI, MITSUO;TSUBOSAKI, KUNIHIRO;MIYAZAKI, MASARU |
| 分类号 |
B42D15/10;G06K19/077;H01L21/822;H01L23/498;H01L23/538;H01L25/04;H01L25/18;H01L27/04 |
主分类号 |
B42D15/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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