Wafer Polierkopf mit schwebendem Halterring

摘要

A polishing head (12) for polishing a semiconductor wafer (56) is described. The head design enables a wafer retainer (27) to float during polishing and yet extend beyond a wafer carrier (28) to define a pocket for the wafer (56) and thereby facilitate wafer changing. The head construction also enables the carrier (28) to be selectively projected beyond the retainer (27) so that the surface of the carrier (28) is easily accessible for changing an insert (30) or the like. The head (12) uses a positive air pressure (22) to press the wafer (56) against the polishing pad (17) and the head (12) includes interfering mechanical constructions which provide the positions mentioned above.