| 摘要 |
<p>An aqueous liquid composition for treating the surface of copper- containing metals is a dispersion and/or solution in water and organic solvent, at least one silane coupling agent having a functional moiety selected from vinyl, mercapto, amino and glycidyloxy moieties bonded to one carbon atom in the silane coupling agent and other epoxy moieties bonded to two adjacent carbon atoms in the silane coupling agent and at least one copper inhibitor compound selected from azoles, azines, aromatic secondary amines, and aromatic diacylhydrazides. Treatment with this composition provides excellent migration resistance, an excellent solder resistance, and a very durable adhesiveness to a variety of copper containing metal surfaces.</p> |
