Verfahren zum Verbinden eines elektrischen Anschlußes eines unverpackten IC-Bauelements mit einer Leiterbahn auf einem Substrat

摘要

The description relates to a process for connecting an electric connection (10) of an unpacked IC component (15) to a conductive track (35) on a substrate (30). An easily metallisable coating is applied to the surface of an electric connection (10) to be contacted. The surface (10, 20) of the connection (10) to be contacted is arranged at a distance from and facing a land (45) of a conductive track (35) on a substrate (30). At the same time an electrically conductive substance (50) is applied to the land (45) and the surface to be contacted (10, 20) to fill the free space between the two surfaces (10, 20; 45) to be contacted.