发明名称 Integrated chassis and resonance component in an electronic device
摘要 <p>An electronic device includes an electronic component and a chassis to support the electronic component. The electronic device also includes a non-supporting chassis component that is integrally formed along with and as part of the chassis. The non-supporting chassis component is functionally operable in cooperation with the electronic component to enhance performance of the electronic component. In one example, the electronic component is an electronic speaker and the non-supporting chassis component is a resonance chamber positioned adjacent to the speaker to improve the speaker's sound qualities. The chassis and non-supporting chassis component (i.e., the resonance chamber) are integrally formed together via a single injection molding process using expanded polypropylene. &lt;IMAGE&gt;</p>
申请公布号 EP0743814(A2) 申请公布日期 1996.11.20
申请号 EP19960302196 申请日期 1996.03.28
申请人 HEWLETT-PACKARD COMPANY 发明人 MCDONOUGH, WILLIAM J.
分类号 H05K7/04;H05K7/14;(IPC1-7):H05K7/14;A61N1/39 主分类号 H05K7/04
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