发明名称 |
Process for production of printed circuit board |
摘要 |
The present invention provides a process for producing a high-density printed wiring board with plated throughholes, at high productivity and reliability by a direct drawing method. The process comprises making throughholes in a substrate having an electro-conductive layer on each side; conducting plating on at least the walls of the substrate throughholes; forming a photosensitive resist film on each side of the substrate; applying an actinic radiation onto the resist film by a direct drawing method in the shape of a pattern to be obtained when the resist film is a negative type, or in the shape of a pattern reverse to a pattern to be obtained when the resist film is a positive type; forming, on the uncoated portion inside the throughholes by electrodeposition, an electrodeposition film which is insoluble in a developing solution used later and an etching solution used later but is removable with a peeling solution used later; conducting development with an appropriate developing solution to remove the resist film; removing the exposed plating layer portion and the electro-conductive layer portion present therebeneath, by etching; and then peeling the remaining resist film and the electrodeposition film inside the throughholes, with an appropriate peeling solution.
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申请公布号 |
US5576148(A) |
申请公布日期 |
1996.11.19 |
申请号 |
US19950382155 |
申请日期 |
1995.02.01 |
申请人 |
KANSAI PAINT CO., LTD. |
发明人 |
IMAI, GENJI;TAKEDA, YUKARI;KOGURE, HIDEO;IWASAWA, NAOZUMI |
分类号 |
H05K3/42;H05K3/00;H05K3/06;H05K3/46;(IPC1-7):G03F7/00 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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