发明名称 CONDUCTIVE FILLER AND CONDUCTIVE SILICONE COMPOSITION
摘要 PURPOSE: To improve the conductivity without detriment to the curability, physical characteristics and thermal characteristics by blending a silicone composition with silver particles or silver-coated particles having a surface treated with a silicone compound. CONSTITUTION: Flaky, spherical or arborescent silver particles or silver-coated other conductive or nonconductive particles having a diameter or maximum length of 0.1-100μm are subjected to surface treatment with a noncurable liquid silicone compound having a viscosity at 25 deg.C of 10-100,000cP to give a conductive filler. A curable or noncurable silicone composition is mixed with this filler in an amount of 0.1-95wt.% based on the total weight of the mixture to give a conductive silicone composition.
申请公布号 JPH08302196(A) 申请公布日期 1996.11.19
申请号 JP19950134814 申请日期 1995.05.08
申请人 SHIN ETSU CHEM CO LTD 发明人 FUJIKI HIRONAO;HARA HIROYASU
分类号 C08K3/00;C08K3/08;C08K9/06;C08L83/04;H01B1/00;H01B1/22;(IPC1-7):C08L83/04 主分类号 C08K3/00
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