One-component reactive resin system comprising a cure-inhibiting glycidyl phosphorus compound

摘要

PCT No. PCT/DE93/01024 Sec. 371 Date May 3, 1995 Sec. 102(e) Date May 3, 1995 PCT Filed Oct. 27, 1993 PCT Pub. No. WO94/10223 PCT Pub. Date May 11, 1994A one-component reactive resin system which is stable in storage but nevertheless can readily be cured completely comprises a mixture of commercially available epoxy resins and phosphorus-containing glycidyl esters, in particular phosphonic acid diglycidyl esters, as well as cationic photoinitiators. The low-viscosity reactive resin systems cannot be cured purely by means of heat and can be processed at high temperatures and in particular can have a high filler content. The reactive resin systems, which are stable to storage even after UV activation, can be cured to flame-resistant molded materials under moderate conditions.