Multi-layer lead-frame for a semiconductor device

摘要

A multi-layer lead-frame for a semiconductor device includes a signal layer made of a metal strip having a signal pattern including a plurality of lead lines. A power supply layer is adhered and laminated to the signal layer and a ground layer is adhered and laminated to the power supply layer. A ceramic plate made of a ferroelectric substance is disposed between the power supply and ground layers. Conductive adhesive material is disposed between said ceramic plate and said first metal layer, and between and adhering to said ceramic plate and said second metal layer.