| 摘要 |
PURPOSE: To provide a wafer sticking device, capable of securing uniform wax thickness, namely, a uniform thickness wafer base at the time when a wafer is secured to a wafer sticking plate and a wafer sticking method using this device. CONSTITUTION: A stamper base 4 and a stamper holder 12 both are detachable, and a load impressing spring 8 to be expanded or contracted by rotating a load adjusting screw 9 with a thread in mesh with a thread cut in this stamper holder 12 is attached to one end of a load shaft 6 and a stamper 5 to the other end respectively, and further a pressure sensor 10 is set up in space between a wafer sticking plate 2 and the stamper base 4. In the case where a wafer 1 to be locked to this wafer sticking plate 2 is a lithium tantalate or lithium niobate monocrystal, any possible load per wafer unit area to be added to the wafer 1 should be set in the range of from 0.03kg/cm<2> to 0.22kg/cm<2> . |
