发明名称 PACKAGING FOR PROTECTING PRINTED CIRCUIT BOARD AND OTHER PRODUCTS
摘要 A printed circuit board support frame for protecting and transporting a printed circuit board. The support frame is molded from moldable materials and comprises a base wall section having elevated support ribs on a top face thereof for supporting the printed circuit board elevated from the base wall section. The base wall section has a hinged retention side wall member formed along a pair of opposed parallel edges thereof. The retention side wall members, when hinged outwardly of the base wall, permit the circuit board to be positioned on the support ribs over the base wall section. The retention side wall members have one or more clamping shoulders projecting forwardly over opposed top side edge portions of the circuit board when the side wall members are maintained in a vertical position to clamp the circuit board over the support ribs. Abutment wall members are formed at predetermined locations on the base wall section to prevent the circuit board from displacement .
申请公布号 CA2071170(C) 申请公布日期 1996.11.19
申请号 CA19922071170 申请日期 1992.06.12
申请人 GROUPE EMBALLAGE INDUSPAC INC. 发明人 COMTOIS, CLAUDE
分类号 B65D5/50;H05K13/00;(IPC1-7):B65D85/30;B65D81/02 主分类号 B65D5/50
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