发明名称 |
Wiring Board for Mounting Electronic Devices with High-Density Terminals and Method for Producing Wiring Board |
摘要 |
A lattice of a wiring or terminal pattern is varied at areas on a wiring board. The spacing of the wiring lattice is reduced only in a predetermined area for a device having many terminals. An alignment pattern is provided in the predetermined area. The spacing of the wiring lattice in the central portion of the wiring board may be the finest and may get gradually coarser toward the peripheral portion of the wiring lattice. <IMAGE> |
申请公布号 |
CA2176789(A1) |
申请公布日期 |
1996.11.19 |
申请号 |
CA19962176789 |
申请日期 |
1996.05.16 |
申请人 |
NEC CORPORATION |
发明人 |
INOUE, TATSUO |
分类号 |
H01L23/12;H01L23/538;H05K1/02;H05K3/30;H05K3/46;(IPC1-7):H05K1/02 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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