发明名称 |
Via-structure of a multilayer interconnection ceramic substrate |
摘要 |
A via-structure off a multilayer interconnection ceramic substrate for a multi-chip module, a semiconductor package and an insulating substrate has a high strength and a high reliability being produced at a low cost. A gap is provided at an interface between a via-conductor and ceramics, and filled with a resin. The resin is preferably of a thermosetting polyimide resin or a benzo-cyclo-butene resin. |
申请公布号 |
US5576518(A) |
申请公布日期 |
1996.11.19 |
申请号 |
US19950439945 |
申请日期 |
1995.05.12 |
申请人 |
NEC CORPORATION |
发明人 |
SHIBUYA, AKINOBU;KIMURA, MITSURU |
分类号 |
H05K3/46;H01L21/48;H01L23/498;H01L23/538;(IPC1-7):H05K1/02 |
主分类号 |
H05K3/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|