发明名称 FILM MOLDING METHOD AND APPARATUS
摘要 <p>PURPOSE: To prevent the wt. shift between a raw material resin and an objective film by calculating the taking-over speed of a film necessary for a production object by using the correction value calculated by the comparison of the width, thickness and length of a film, the consumption wt. of the raw material resin calculated from the wt. of the raw material resin and the wt. of the film. CONSTITUTION: The operation part 36 provided to a film molding apparatus 33 is connected to a film length measuring means 20, an upper limit sensor 27, a lower limit sensor 28, a film thickness measuring means 42, a film width measuring means 43 and a wt. measuring balance 45 measuring the wt. of a film F to input measuring data. Various set values of a raw material resin R and the objective film F are inputted by the input machinery 44 connected to the operation part 36 and, on the basis of various set values and the measuring data, the consumption speed of the raw material resin R, a correction value and the taking-over speed of the film F are operated. A control part 46 controls the taking-over speed of the film F and the air supplied into a bulb 10 on the basis of these operation results.</p>
申请公布号 JPH08300446(A) 申请公布日期 1996.11.19
申请号 JP19950115769 申请日期 1995.05.15
申请人 TOMY KIKAI KOGYO KK 发明人 SARUWATARI SHINJI;FUJITA MASAAKI
分类号 B29C47/92;B29L7/00;(IPC1-7):B29C47/92 主分类号 B29C47/92
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