发明名称 SURFACE MODIFICATION OF POLYPROPYLENE MOLDING FOR PLATING OR BONDING
摘要 PURPOSE: To readily modify the surface of polypropylene, enable plating with good adhesion and improve adhesiveness by bringing a polypropylene molding into contact with atmosphere having a specific fluorine concentration for a certain time. CONSTITUTION: A polypropylene molding is brought into contact with atmosphere having 0.1-10%, preferably 0.5-5% fluorine concentration for 1-30min, preferably 1-10min to make the surface of the molding hydrophilic. Thereby, contact angle of the molding is kept to <=80 degree. The atmosphere is usually a mixed gas of fluorine gas with other inert gas and e.g. N2 , argon, helium, etc., is used as an inert gas. Furthermore, when the polypropylene molding subjected to modification treatment is bonded to a polypropylene molding, the modification treatment is preferably applied to the latter. An epoxy-based or cyanoacylate-based adhesive is preferably used for bonding polypropylene moldings to each other or bonding a polypropylene molding to any other resin or a metal.
申请公布号 JPH08302039(A) 申请公布日期 1996.11.19
申请号 JP19950137305 申请日期 1995.05.10
申请人 HASHIMOTO CHEM CORP 发明人 HASHIMOTO TSUGUO;MAENO MATAGORO;HIRAYAMA RYOJI
分类号 C08J7/00;(IPC1-7):C08J7/00 主分类号 C08J7/00
代理机构 代理人
主权项
地址