| 摘要 |
PURPOSE: To lap the back of a wafer into a rough surface without entailing any crack and chipping in and around this lithium tantalate pr lithium niobate monocrystal wafer. CONSTITUTION: In a job for processing the surface of a lithium tantalate or niobate lithium monocrystal wafer into a rough surface, lapping work is carried out in a state that paste 1 having solidified powder consisting of the same quality of material as the wafer to be lapped is applied to a peripheral part of this wafer 2. |
