发明名称 Abdeckkappe für elektronisches Bauelement
摘要 The invention proposes a cover (1) for a base plate (2) bearing at least one electronic component (3). The cover is firmly secured to the base plate bearing the electronic component by adhesion, soldering or engagement. There is an aperture (7) forming an air outlet to prevent damage during e.g. the soldering process. The cover may form electronic modules which can be processed like an ordinary component for fitting on printed circuit boards.
申请公布号 DE19516548(A1) 申请公布日期 1996.11.14
申请号 DE1995116548 申请日期 1995.05.05
申请人 BLAUPUNKT-WERKE GMBH, 31139 HILDESHEIM, DE 发明人 DOBERS, MICHAEL, DR., 31134 HILDESHEIM, DE
分类号 H01L21/50;H01L23/04;H01L25/16 主分类号 H01L21/50
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