| 摘要 |
<p>An apparatus for reducing the intensity and frequency of arcing in a reactive DC sputtering process when the process uses an arc-suppression system (2) which interrupts or reverses the voltage applied to the sputtering target. A plasma (28) having required properties is introduced into the vicinity of the sputtering target (24) by means of a separate plasma applicator (26, 27) whic operates independently of the target.</p> |
