摘要 |
The jacket layers (3, 5) of a double-heterostructure (3-5) sandwich a light emitting layer (4). The top jacket layer (5) carries a current propagation layer (6) of very low thickness. On the current propagation layer is located a contact layer structure (7, 9) with branched and finger-like electrodes (7). Pref., the current propagation layer is sufficiently thin as to hardly absorb any radiation. It is made by economical MOCVD process. The contact layer structure has electrodes distributing, together with the current propagation layer, the current sufficiently on the surface of the light emitting layer.
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申请人 |
TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILBRONN, DE |
发明人 |
GILLESSEN, KLAUS, DIPL.-PHYS. DR., 74074 HEILBRONN, DE;GERNER, JOCHEN, DIPL.-PHYS., 69168 WIESLOCH, DE |