ELECTRONIC CIRCUIT DEVICE

摘要

PURPOSE: To prevent both a short-circuit failure from occurring at a spot where an electronic part and a circuit board are narrow in gap between them and an open-circuit failure from occurring at a spot where an electronic part and a circuit board are wide in gap between them by a method wherein electrodes are set wide in their area and in space between them, and solder bumps are set small in size at the spot where a gap is narrow. CONSTITUTION: Electrodes 3 and 4 located at a spot where a gap between an electronic circuit part 1 and a circuit board 2 is narrow are set wider in space between them and in their area than those located at a spot where a gap is wide, and furthermore solder bumps 5 located at a spot where a gap is narrow are set smaller in size than those located at a spot where a gap is wide.