| 摘要 |
PURPOSE: To facilitate high density arrangement and temperature control of chips or the like besides establishing a supporting method at the time of manu facture by arranging chips or the like on a hexahedron and providing a means to maintain a required temperature by cooling (heating) on the interior and allowing an interchip stereoscopic proximity arrangement requiring short wiring. CONSTITUTION: The main unit 20 is composed of a six-face body whose respective ridge lines are chamfered 21, 22, chip-mounting parts 23, 24, 25, 26 are arranged on the main unit surface, a temperature control means 10 for keeping required temperature inside the main unit, pipes 11, 12 making a fluid for cooling (thermal insulation) to flow into or flow out from the temperature, control means are mounted on the opposing sumits of the hexahedron and part of the pipes combines a grip for supporting at the time of manufacture. |
