| 摘要 |
A method of inspecting an array of balls used as connections in integrated circuit modules such as Solder Ball Connection modules, by means of an inspection apparatus that includes a microprocessor (34), a support (32) for holding in place the modules to be inspected (30), the microprocessor controlling a vertical camera (38) and a tilted camera (40) for obtaining images of the balls, wherein said method includes measuring the X and Y coordinates of each ball of the array to determine a best fitting grid of the balls, detecting the Z coordinate of each ball to determine the best fitting plane for the array of balls, offsetting the best fitting plane such that the offset plane also includes the lowest ball of the array, computing the deviation between each ball and the offset plane, and comparing the computed deviations with predetermined specifications to ascertain whether the inspected module is in compliance with the specifications.
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