发明名称 MANUFACTURING PROCESS OF MODULE TYPE ELECTRICAL BONDING COMPONENT AND MODULE TYPE ELECTRICAL BONDING COMPONENT THAT IS OBTAINED BY IT
摘要 <p>PROBLEM TO BE SOLVED: To realize a module property, manufacturing facilitation, and cost reduction for mass-produced electrical connection members. SOLUTION: A module-type connection member C0 is manufactured of independent basic connectors 41 to 48 , each having openings. A shield member 5d is manufactured of a sheet. The basic connectors 41 to 48 are linked integrally to each other by covering surfaces of the entire connection member C0 acquired in this way by the shield member 5d and by pressing specific regions 50d to 52d of the shield member into the openings. This process is applied especially to the manufacture of connection members C0 between printed wiring motherboards and/or daughter boards.</p>
申请公布号 JPH08298175(A) 申请公布日期 1996.11.12
申请号 JP19960100509 申请日期 1996.04.22
申请人 FURAMATOMU KONEKUTAAZU INTERNATL 发明人 DOMINIKU ECHIENBURE;JIYATSUKII TENESHII
分类号 H01R24/00;H01R12/50;H01R12/72;H01R43/00;(IPC1-7):H01R43/00 主分类号 H01R24/00
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