ADHESIVE FILM HAVING ANISOTROPIC ELECTROCONDUTIVITY

摘要

PURPOSE: To obtain an anisotropically electroconductive adhesive film having a specific composition connectable in high connection reliability without generating bubbles during the connection process by using a cross-linking agent having a specific property in the conversion of the film to a B-stage. CONSTITUTION: This adhesive film contains at least (A) an epoxy resin, (B) electroconductive particles and (C) a latent curing agent and further contains (D) a corross-linking agent reactive with the component C in preference to the component A and is converted to B-stage by the reaction of the componnent D with the component C. The component C is preferably a micro-encapsulated latent curing agent and the component D is preferably an iscocyanate-based cross-linking agent having >=2 isocyanate groups, especially trimethylxylylene diisocyanate. The melt viscosity of the film in hot-pressing is preferably 1×10<4> to 5.0×10<5> poise.