发明名称 IC carrier
摘要 An IC socket includes a socket body, an IC receiving portion formed in the socket body, an engagement members for engaging an upper edge or upper surface of an IC package received in the IC receiving portion and applying a push-down force thereto, and a support members for elastically supporting the lower surface or lower edge of the IC package and applying a push-up force thereto. The IC package is held between the support members and the engagement members.
申请公布号 US5573427(A) 申请公布日期 1996.11.12
申请号 US19940183937 申请日期 1994.01.21
申请人 YAMAICHI ELECTRONICS CO., LTD. 发明人 SAGANO, HIDEKI
分类号 B65D85/00;B65D85/86;H01L23/00;H01L23/32;H05K7/10;(IPC1-7):H05K1/00 主分类号 B65D85/00
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