发明名称 Method for fabrication of CMOS devices having minimized drain contact area
摘要 There are disclosed a semiconductor device and a method for fabrication thereof. The semiconductor device comprises an insulating film for well isolation which electrically insulates N-well from P-well, the drain electrode of PMOS and the drain electrode of NMOS being adjacent to the trench for well isolation, and a conductive wire filling one contact hole which interconnects the drain electrodes of N-well with those of P-well. The semiconductor device is very reduced in size, and thus, high integration thereof can be achieved.
申请公布号 US5573969(A) 申请公布日期 1996.11.12
申请号 US19950375551 申请日期 1995.01.19
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 KIM, JAE K.
分类号 H01L21/28;H01L21/60;H01L21/762;H01L21/768;H01L21/8238;H01L27/092;(IPC1-7):H01L21/70 主分类号 H01L21/28
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