Method of removing residual charges of an electrostatic chuck used in a layer deposition process

摘要

A method depositing a layer onto a wafer is disclosed. The method has the steps of: affixing the wafer to a wafer support within a deposition chamber by using a single-pole electrostatic chuck; depositing a layer onto a surface of the wafer by plasma by CVD; exhausting a deposition gas used for depositing the layer from the deposition chamber; introducing a residual charge removing gas into the deposition chamber; and forming a residual charge removing plasma by discharging the gas to remove residual charges of the single-pole electrostatic chuck.