| 摘要 |
A method of forming an environmentally sealed transponder type circuit wherein the circuit components are mounted on a lead type substrate frame, the components are encapsulated in a plastic housing in a plastic molding process so that the housing is supported in the frame only by a plurality of the leads, and then severing the leads at the periphery of the housing to provide a leadless package. The frame may be formed of a conductive material, an insulating material or as a printed circuit board. A novel printed circuit type lead frame whereby a coil of the circuit may be mechanically attached and directly secured to the frame is additionally disclosed. |
