KUNSTHARZVERSIEGELTES HALBLEITERBAUELEMENT

摘要

A thin semiconductor device in which a semiconductor element (51) mounted on an element-mounting portion (52) having a first thickness is connected through conductors (53) with a plurality of electrically conductive leads (54) having, at least partly, a second thickness greater than the first thickness, and the device is molded with a resin maintaining the second thickness such that front and back surfaces of these leads (54) are partly exposed. Using the upper and lower metal molds, the device is sealed with the resin under a condition in which it is depressed to the second thickness to prevent thin flashes of resin (55) from generating on the surfaces on which the leads are exposed. Further, the portions having the second thickness of the leads (54) are folded in a manner that the extending portions of the leads (54) protrude toward the other leads (54), and the insulating reinforcing member is held by the extending portions of the plurality of leads. Therefore, the leads are prevented from being removed, and the semiconductor device exhibits increased mechanical strength.