发明名称 Chip-Abdeckung
摘要 The description relates to a chip cover (5, 6, 11) to cover electrical, electronic, opto-electronic and/or electromechanical components of a chip (1, 8) completely or partly. In the chip cover (5, 6, 11), there is an activator (12) which, when activated, is capable of completely or partly destroying the electrical, electronic, opto-electronic and/or electromechanical components of the chip (1, 8) and can be activated by an attempt to remove the cover (5, 6, 11) from the chip (1, 8). It is thus possible reliably to prevent the unauthorised analysis and/or manipulation of the chip (1, 8).
申请公布号 DE19515188(A1) 申请公布日期 1996.11.07
申请号 DE1995115188 申请日期 1995.04.25
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 NIEDERLE, CHRISTINE, 81735 MUENCHEN, DE;STAMPKA, PETER, 92421 SCHWANDORF, DE;STECKHAN, HANS-HINNERK, 81827 MUENCHEN, DE;KIRSCHBAUER, JOSEF MICHAEL, 93476 BLAIBACH, DE;HOUDEAU, DETLEF, DR.-ING., 84085 LANGQUAID, DE
分类号 H01L23/29;G06K19/073;G06K19/077;H01L23/28;H01L23/31;H01L23/58;H01L25/065;H01L25/07;H01L25/18 主分类号 H01L23/29
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