Apparatus for and method of transferring an encapsulating material to a mold cavity

摘要

An apparatus for and a method of transferring an encapsulating material uses a runner (45) for guiding the encapsulating material from a pot (44) to a mold cavity (43) which contains a semiconductor device (18) mounted on a leadframe (16) for joint encapsulation. Adjacent to the runner (45), protrusions (47) on a first plate (46) mate with protrusions (31) on a second plate (49) to form a vertical side seal (39) for containing the encapsulating material in the runner (45) and for preventing flash formation originating from the runner (45) and from the mold cavity (43). The use of the vertical side seal (39) enables a mold apparatus (41) to be used for encapsulating leadframes (16) of different thicknesses.