发明名称 |
Hermetically sealed ceramic integrated circuit heat dissipating package |
摘要 |
A method and apparatus for achieving a hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein. Use of an ultra-thin integrated circuit chip die, thin ceramic housing layers and external lead frame allow an ultra-thin overall package that may be used singularly or further densely packaged into a three dimensional multi-package array and still meet the critical performance and reliability requirements for both military and aerospace applications. |
申请公布号 |
US5572065(A) |
申请公布日期 |
1996.11.05 |
申请号 |
US19940328338 |
申请日期 |
1994.10.24 |
申请人 |
STAKTEK CORPORATION |
发明人 |
BURNS, CARMEN D. |
分类号 |
H01L21/50;H01L23/04;H01L23/057;H01L23/10;H01L23/13;H01L23/36;H01L23/495;H01L23/498;H01L23/552;H01L23/556;H01L23/66;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|