| 摘要 |
PURPOSE: To obtain a compact package which is excellent in humidity resistance by resin-sealing a first connection part and thereafter removing a conducive temporarily supporting material, forming a wiring pattern which makes a continuity with a connection part in a sealing material surface, forming a second connection part which makes a continuity with a wiring pattern, making a chip make a continuity with it and carrying out resin sealing. CONSTITUTION: A wiring 42 is formed by applying Ni plating to a copper foil 41, laminating a photosensitive dry resist film, exposing and developing a wiring pattern-like resist, applying copper, Ni and gold plating and peeling a resist. After a copper foil 41 wherein the wiring 42 is formed in cut and bent in advance, it is set in a molding die, a plate-like molded item 43 is molded by using a resin sealing material and the wiring 42 is buried and transcribed in a surface of the molded item 43. Thereafter, the copper foil 41 alone is dissolved and removed, an Ni layer is removed and the wiring 42 is exposed. After a semiconductor chip 4 is mounted by using a die bond material 45 and a semiconductor chip terminal and the wiring 42 are connected by a gold line 46, sealing is carried out by potting by using a resin sealing material 50. |
