发明名称 MANUFACTURE OF COPPER PASTE, CERAMIC MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURE THEREOF
摘要 PURPOSE: To obtain a method of manufacturing a ceramic multilayer printed circuit board, which can reduce the number of defects in a wiring pattern. CONSTITUTION: A binder, such as ethyl cellulose, is compounded with organic solvent, such as n-butylcarbitol acetate, the binder is dissolved to turn into a vehicle, this vehicle is filtered by a filter of a hole diameter of 5 to 50μm or thereabouts, for example, the filtered vehicle is compounded with copper powder and the vehicle is mixed with the copper powder to turn into a copper paste. This copper paste is used in the manufacture of a ceramic multilayer printed circuit board, desired patterns are respectively printed on green sheets, then, the green sheets are laminated and the laminated material is subjected to firing to manufacture the board.
申请公布号 JPH08293652(A) 申请公布日期 1996.11.05
申请号 JP19950099124 申请日期 1995.04.25
申请人 HITACHI LTD 发明人 HORIKOSHI MUTSUMI;SEKIHASHI MASAO;TOZAKI HIROMI;MORI YASUHIRO;NOGUCHI TAKAHIRO;SHOJI FUSAJI;KINOSHITA MADOKA
分类号 H05K1/09;(IPC1-7):H05K1/09 主分类号 H05K1/09
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