发明名称 PHENOLIC RESIN MOLDING MATERIAL AND MOLDING METHOD THEREFOR
摘要 PURPOSE: To obtain the subject material capable of reducing failure occurrence such as blister of its molded product even if subjected to high speed injection molding at elevated mold temperatures by blending a melamine solid resin having a specified methylenation rate with a phenolic resin and filler. CONSTITUTION: This molding material is obtained by blending (A) a phenolic resin (e.g. a novolak resin, a resol resin) and (B) a filler (e.g. glass fiber, slaked lime, etc.) with (C) a melamine solid resin having a methylenation rate of 50 to 80% in an amount ranging from 1 to 5wt.% based on the whole amount of the phenolic resin molding material. The molding material is obtained, for example, by blending the components A to C, a releasing agent such as zinc stearate, and a curing agent such as hexamethylenetetramine, and subjecting the mixture to mixing dispersion, kneading, granulation, etc. For this molding material, the mold temperature at its injection molding can be set at 190 to 210 deg.C.
申请公布号 JPH08291248(A) 申请公布日期 1996.11.05
申请号 JP19950097110 申请日期 1995.04.21
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KAWAMURA NOBUYUKI;UENO AKIRA;KAWAKITA HIDEKI
分类号 B29C45/00;B29K61/04;C08L61/04;C08L61/06;(IPC1-7):C08L61/06 主分类号 B29C45/00
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