| 摘要 |
PURPOSE: To enable a large number of semiconductor chips to be mounted high in density by a method wherein a circuit pattern is formed on the surface of a liquid crystal polymer film, the liquid crystal polymer films are laminated into a board through the intermediary of a prepreg, and plural bare chips are mounted on the one side of the board. CONSTITUTION: A circuit pattern is formed on the surface of a double-side copper plated liquid crystal polymer film 1 by the use of resist and a ferric chloride solution. 10 pieces of the double-side copper plated liquid crystal polymer film 1 where a circuit pattern is formed are laminated into a board through the intermediary of an epoxy-impregnated aramide nonwoven cloth as prepreg 2. Five bare chips are mounted on the one side of the board through BGA for the formation of a multi-chip module. By this setup, a large number of semiconductor chips can be mounted high in density and low in permittivity and thermal linear expansion coefficient.
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